OUR SERVICES
Electronics manufacturing
From Prototype to Mass Production—Precise Craftsmanship, Reliable Quality
We don't just implant—we manufacture reliably
ZANE Systems’ electronics manufacturing is more than just a production line. With our own state-of-the-art SMT equipment, we handle everything in-house—from prototypes to small and medium-sized production runs. This is a huge advantage for our customers, since our design desk and assembly line are located in the same building—thus drastically shortening development cycles and minimizing sources of error.
“We operate in accordance with the highest quality standards: IPC-A-610 Class 3. We manufacture products that operate reliably in industrial environments for many years.”
Because we know that even the best design is only as good as the manufacturability and reliability of the final product.
What do we manufacture?
A full range of hardware development services—all in one place, with a team of experts
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SMT Assembly
Our modern placement machines ensure precise component placement for SMD components as small as 0201. We inspect every single piece using automatic optical inspection (AOI).
- Automated Optical Inspection (AOI)
- 0201 - BGA, μBGA, QFN packaging
- Multilayer PCB Processing
- Dual-side assembly
Technologies
- Reflow Soldering
- Lead-free / Contains lead
- Nitrogen atmosphere
- Convection oven
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THT Assembly
Precise insertion and soldering of traditional through-hole components. Ideal for connection points and connectors subjected to high mechanical stress.
- Manual and Selective Soldering
- Connectors, Terminals
- High-Performance Components
- Mixed technology (SMT+THT)
Technologies
- Wave soldering
- Selective soldering
- Hand soldering (IPC-610)
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Prototype Manufacturing
Rapid iterations with engineering input. Prototypes can be tested immediately and quickly modified based on feedback. We perform DFM analysis for every project.
- Prototypes ready within 1 week
- DFM Analysis and Optimization
- Engineering supervision at every step
- On-site functional testing
PCB Suppliers
- JLCPCB
- PCBWay
- Eurocircuits
- Hazai partnerek
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Small- and Medium-Volume Production
From 50 to several thousand units. Flexible capacity, guaranteed quality, fast turnaround time. Documented manufacturing process and full traceability.
- There is no minimum order quantity
- Batches of 50–5,000+ pieces
- Documented manufacturing process
- Traceable production records
Capacity
- ~500–1,000 parts per hour
- 50-5000 pcs/project
- Thousands of parts/month
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Thousands of parts per month: Testing and Quality Assurance
Every unit is inspected. AOI, X-ray, functional, and circuit tests ensure our goal of zero defects. We operate in accordance with the IPC-A-610 Class 3 standard.
- IPC-A-610 Class 3 Standard
- Automated Optical Inspection (AOI)
- X-ray examination (BGA inspection)
- Custom functional test environment
Testing Methods
- AOI (Automated Optical)
- X-ray inspection
- Flying probe
- ICT (In-Circuit Test)
- Functional test
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Coating Treatment
Applying a protective coating to circuits to protect them against moisture, dust, chemicals, and mechanical stress. Essential for industrial and outdoor applications.
- Acrylic, silicone, and polyurethane coatings
- Selective masking
- Increasing IP Protection (IP54–IP67)
- In accordance with the IPC-HDBK-830 standard
Types of Coatings
- Acrylic (AR)
- Silicone (SR)
- Polyurethane (UR)
- Parylene (XY)
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Procurement of Materials
We source parts exclusively through official distribution channels. Minimized risk, guaranteed authenticity. Proactive obsolescence management.
- Official distributors (Mouser, Digi-Key, TME)
- Obsolescence Management
- Alternative Sources of Parts
- Logistics Coordination
Suppliers
- Mouser Electronics
- Digikey
- TME
- Farnell
- RS Components
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Box Build and Assembly
We don't just manufacture the PCB; we manufacture the entire product. This includes assembly, cable assembly, functional testing of the finished product, and packaging.
- Complete Product Assembly
- Cable Assembly
- Functional testing of the final product
- Packaging and Logistics
Housing types
- DIN-sín házak
- IP védett dobozok
- Egyedi 3D nyomtatott házak
- Fém, műanyag házak
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DFM/DFT Optimation
Design for Manufacturing and Design for Testing. We optimize manufacturability and testability as early as the design phase, thereby avoiding costly manufacturing defects.
- Manufacturability Analysis
- Placement of Test Points
- Optimization of Component Placement
- Cost-Cutting Proposals
Tools
- Altium Designer DFM
- IPC-2221 / IPC-7351
- Valor NPI
- CAM350
What kinds of projects do we carry out?
Examples of the types of products we have designed and manufactured
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Portable ECG Device
Challenge: Processing medical-grade ECG signals in an ultra-compact design with Bluetooth connectivity and long battery life.
Solution: Solution: 24-bit ADC, differential preamplifier, 50 Hz/60 Hz notch filter, BLE 5.0, 500+ measurements powered by a CR2032 battery.
STM32L4
ADS1293
BLE 5.0
Class IIa
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IoT Agricultural Sensor
Challenge: Outdoor use, -20°C...+60°C, IP67 protection, 5-year battery life, 10 km range.
Solution: LoRaWAN Class A, ultrasonic soil moisture sensor, solar panel + Li-ion backup, data transmission every hour.
LoRaWAN
STM32WL
IP67
Solar
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Industrial Gateway
Challenge: Connecting legacy devices (RS485, Modbus) to the cloud, DIN-rail mounting, industrial temperature range (-40°C...+85°C).
Solution: Multi-protocol support, LTE-M/Wi-Fi dual connectivity, MQTT bridge, redundant power supply.
Linux SoM
RS485
LTE-M
Modbus
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Smart Lighting Controller
Challenge: City-wide smart street lighting control, dimming, energy metering, and remote monitoring.
Solution: DALI-2 interface, NB-IoT connectivity, real-time energy measurement, astronomical clock, presence detection.
DALI-2
NB-IoT
Energy Meter
PIR
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E-Mobility Charging Controller
Challenge: Electric vehicle charging control, OCPP protocol, dynamic load management, MID-certified measurement.
Solution: Type 2 connector control, 3-phase measurement, OCPP 1.6J/2.0.1, ISO 15118, RFID authentication.
OCPP
ISO 15118
3-phase meter
LTE
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Laboratory Measuring Head
Challenge: 16-bit precision, 1 MSPS sampling, USB 3.0 data transfer, galvanic isolation, noise filtering.
Solution: 16-bit SAR ADC, differential input, FPGA-based preprocessing, USB 3.0 FX3, isolated power supply.
FPGA
USB 3.0
16-bit ADC
Isolated
